Wafer Cooling Station from Japan

Automated wafer cooling stations rapidly cool semiconductor wafers post-high-temperature processing using controlled inert gas or liquid nitrogen flows to prevent thermal shock and defects. Essential temperature change equipment in wafer fab. Classifies under HTS 8419.89.95 cooling apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify cooling rates (e.g

• 100°C/sec) and cleanroom compatibility

• Classify separately from vacuum chambers (8419.89.50) if not under vacuum

• End-use statement critical for semiconductor exemption consideration