8419.89.95/Wafer Cooling Station/Japan

Wafer Cooling Station from Japan

Automated wafer cooling stations rapidly cool semiconductor wafers post-high-temperature processing using controlled inert gas or liquid nitrogen flows to prevent thermal shock and defects. Essential temperature change equipment in wafer fab. Classifies under HTS 8419.89.95 cooling apparatus.

Duty Rate — Japan → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify cooling rates (e.g

• 100°C/sec) and cleanroom compatibility

• Classify separately from vacuum chambers (8419.89.50) if not under vacuum

• End-use statement critical for semiconductor exemption consideration

Wafer Cooling Station from Japan — Import Duty Rate | HTS 8419.89.95