Wafer Cooling Station from Japan
Automated wafer cooling stations rapidly cool semiconductor wafers post-high-temperature processing using controlled inert gas or liquid nitrogen flows to prevent thermal shock and defects. Essential temperature change equipment in wafer fab. Classifies under HTS 8419.89.95 cooling apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify cooling rates (e.g
• 100°C/sec) and cleanroom compatibility
• Classify separately from vacuum chambers (8419.89.50) if not under vacuum
• End-use statement critical for semiconductor exemption consideration