Silicon Crystal Annealing Furnace from China
Rapid thermal annealing equipment for semiconductor crystals uses precisely controlled heating/cooling cycles to relieve stresses in silicon boules post-grinding, preventing wafer cracking. Temperature treatment process per Chapter 84. HTS 8419.89.95 for non-furnace specific semiconductor thermal equipment.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document ramp rates (e.g
• 50°C/sec) proving semiconductor-grade thermal control
• Avoid 8514 classification by emphasizing process integration over furnace function
• Include boule size compatibility (150-450mm) specs