Semiconductor Wafer Lapper from Germany
Semiconductor wafer lappers use abrasive slurries with temperature-controlled slurries to lap both sides of silicon wafers simultaneously, achieving critical flatness for device fabrication. Part of wafer preparation equipment in statistical note (a)(ii)(C). HTS 8419.89.95 covers the temperature-regulated lapping process.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide flatness specification data (e.g
• <1μm TTV) proving semiconductor application
• Ensure slurry temperature control documentation to justify 8419 classification