Semiconductor Wafer Lapper from China
Semiconductor wafer lappers use abrasive slurries with temperature-controlled slurries to lap both sides of silicon wafers simultaneously, achieving critical flatness for device fabrication. Part of wafer preparation equipment in statistical note (a)(ii)(C). HTS 8419.89.95 covers the temperature-regulated lapping process.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Provide flatness specification data (e.g
• <1μm TTV) proving semiconductor application
• Ensure slurry temperature control documentation to justify 8419 classification