Semiconductor Drying Oven from China
Cleanroom-compatible drying ovens for semiconductor wafers post-RCA cleaning use filtered hot air (80-150°C) with laminar flow to remove moisture without contamination. Statistical note temperature processing. HTS 8419.89.95 drying equipment.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify ISO cleanroom class and HEPA filtration to prove semiconductor use
• Avoid domestic purpose exclusion by documenting fab-scale capacity
• Temperature uniformity data (±1°C) supports classification