Crystal Boule Grinder from Japan
Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and cut flats indicating conductivity type, using controlled cooling during abrasive processes to prevent thermal damage. Essential for wafer preparation in semiconductor fabs. Classified in HTS 8419.89.95 due to integrated temperature management in material treatment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat-grinding specifications matching statistical note (a)(ii)(A) for proper classification
• Avoid misclassification as general grinding machinery under 8460 by emphasizing semiconductor end-use
• Prepare for CBP review of temperature control systems in grinding coolant