Crystal Boule Grinder from China
Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and cut flats indicating conductivity type, using controlled cooling during abrasive processes to prevent thermal damage. Essential for wafer preparation in semiconductor fabs. Classified in HTS 8419.89.95 due to integrated temperature management in material treatment.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document flat-grinding specifications matching statistical note (a)(ii)(A) for proper classification
• Avoid misclassification as general grinding machinery under 8460 by emphasizing semiconductor end-use
• Prepare for CBP review of temperature control systems in grinding coolant