Wafer Lapping Machine from Japan
Equipment that lap semiconductor wafers to achieve precise flatness and thickness uniformity using abrasive slurries and temperature-controlled platens. Classified in HTS 8419.89.95.85 for wafer preparation involving material treatment by temperature change on other semiconductor materials.
Duty Rate — Japan → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document flatness specifications (bow/warp <1μm) to confirm wafer prep classification
• Include platen temperature control evidence to qualify under temperature treatment heading
• Beware bulk lappers without semiconductor tolerances shifting to 8460 grinding machines