Wafer Lapping Machine from China
Equipment that lap semiconductor wafers to achieve precise flatness and thickness uniformity using abrasive slurries and temperature-controlled platens. Classified in HTS 8419.89.95.85 for wafer preparation involving material treatment by temperature change on other semiconductor materials.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document flatness specifications (bow/warp <1μm) to confirm wafer prep classification
• Include platen temperature control evidence to qualify under temperature treatment heading
• Beware bulk lappers without semiconductor tolerances shifting to 8460 grinding machines