Stress Relief Annealing Oven for Wafers from Mexico
Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.
Duty Rate — Mexico → United States
14.2%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Ramp rate and soak temperature profiles must show semiconductor-specific cycles
• Wafer carrier compatibility documentation required
• General annealing ovens classify under 8514 if furnace-type