Stress Relief Annealing Oven for Wafers from Japan
Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Ramp rate and soak temperature profiles must show semiconductor-specific cycles
• Wafer carrier compatibility documentation required
• General annealing ovens classify under 8514 if furnace-type