8419.89.95.85/Stress Relief Annealing Oven for Wafers/Japan

Stress Relief Annealing Oven for Wafers from Japan

Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Ramp rate and soak temperature profiles must show semiconductor-specific cycles

• Wafer carrier compatibility documentation required

• General annealing ovens classify under 8514 if furnace-type