Stress Relief Annealing Oven for Wafers from China
Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Ramp rate and soak temperature profiles must show semiconductor-specific cycles
• Wafer carrier compatibility documentation required
• General annealing ovens classify under 8514 if furnace-type