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8419.89.95.85/Stress Relief Annealing Oven for Wafers/Canada

Stress Relief Annealing Oven for Wafers from Canada

Precision annealing furnace for relieving internal stresses in processed semiconductor wafers through controlled heating/cooling cycles. HTS 8419.89.95.85 for temperature treatment of other semiconductor materials post-processing.

Duty Rate — Canada → United States

14.2%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Ramp rate and soak temperature profiles must show semiconductor-specific cycles

• Wafer carrier compatibility documentation required

• General annealing ovens classify under 8514 if furnace-type

Stress Relief Annealing Oven for Wafers from Canada — Import Duty Rate | HTS 8419.89.95.85