Silicon Carbide Wafer Polishing Station from Japan
Temperature-controlled polishing station for SiC wafers used in power electronics, featuring high-temperature slurries and precise thermal management. Classified HTS 8419.89.95.85 as wafer prep for other semiconductor materials beyond silicon/GaAs.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify SiC hardness (Mohs 9.5) and elevated processing temps to justify classification
• Provide application evidence for power electronics/LED production
• General polishers risk 8460 classification without semiconductor-specific features