8419.89.95.85/Silicon Carbide Wafer Polishing Station/Japan

Silicon Carbide Wafer Polishing Station from Japan

Temperature-controlled polishing station for SiC wafers used in power electronics, featuring high-temperature slurries and precise thermal management. Classified HTS 8419.89.95.85 as wafer prep for other semiconductor materials beyond silicon/GaAs.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify SiC hardness (Mohs 9.5) and elevated processing temps to justify classification

• Provide application evidence for power electronics/LED production

• General polishers risk 8460 classification without semiconductor-specific features