8419.89.95.85/Silicon Carbide Wafer Polishing Station/China

Silicon Carbide Wafer Polishing Station from China

Temperature-controlled polishing station for SiC wafers used in power electronics, featuring high-temperature slurries and precise thermal management. Classified HTS 8419.89.95.85 as wafer prep for other semiconductor materials beyond silicon/GaAs.

Duty Rate — China → United States

41.7%

Rate breakdown

9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Specify SiC hardness (Mohs 9.5) and elevated processing temps to justify classification

• Provide application evidence for power electronics/LED production

• General polishers risk 8460 classification without semiconductor-specific features