8419.89.95.85/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

High-precision diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules, featuring coolant circulation systems for temperature stabilization during cutting. Falls under HTS 8419.89.95.85 as wafer preparation equipment for other materials involving cooling processes.

Duty Rate — Japan → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Include wafer thickness tolerances (typically <100μm) and coolant system specs in entry docs

• Differentiate from metallurgical saws by proving semiconductor boule slicing capability

Semiconductor Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8419.89.95.85