Semiconductor Wafer Slicing Saw from China
High-precision diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules, featuring coolant circulation systems for temperature stabilization during cutting. Falls under HTS 8419.89.95.85 as wafer preparation equipment for other materials involving cooling processes.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Include wafer thickness tolerances (typically <100μm) and coolant system specs in entry docs
• Differentiate from metallurgical saws by proving semiconductor boule slicing capability