Semiconductor Wafer Slicing Saw from Canada
High-precision diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules, featuring coolant circulation systems for temperature stabilization during cutting. Falls under HTS 8419.89.95.85 as wafer preparation equipment for other materials involving cooling processes.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include wafer thickness tolerances (typically <100μm) and coolant system specs in entry docs
• Differentiate from metallurgical saws by proving semiconductor boule slicing capability