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8419.89.95.85/Edge Grinding Machine for Wafers/Japan

Edge Grinding Machine for Wafers from Japan

Automated edge profiling and grinding machine for semiconductor wafers to prevent chipping during handling, with coolant temperature regulation. HTS 8419.89.95.85 for wafer preparation cooling processes on other materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify edge profiles (laser diced, straight, full arc) for semiconductor wafers

• Coolant temperature stability data critical for 8419 temperature process proof

• Standalone grinders without wafer handling may classify under 8460

Edge Grinding Machine for Wafers from Japan — Import Duty Rate | HTS 8419.89.95.85