Edge Grinding Machine for Wafers from Japan
Automated edge profiling and grinding machine for semiconductor wafers to prevent chipping during handling, with coolant temperature regulation. HTS 8419.89.95.85 for wafer preparation cooling processes on other materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (laser diced, straight, full arc) for semiconductor wafers
• Coolant temperature stability data critical for 8419 temperature process proof
• Standalone grinders without wafer handling may classify under 8460