Edge Grinding Machine for Wafers from Germany
Automated edge profiling and grinding machine for semiconductor wafers to prevent chipping during handling, with coolant temperature regulation. HTS 8419.89.95.85 for wafer preparation cooling processes on other materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify edge profiles (laser diced, straight, full arc) for semiconductor wafers
• Coolant temperature stability data critical for 8419 temperature process proof
• Standalone grinders without wafer handling may classify under 8460