Edge Grinding Machine for Wafers from Germany
Automated edge profiling and grinding machine for semiconductor wafers to prevent chipping during handling, with coolant temperature regulation. HTS 8419.89.95.85 for wafer preparation cooling processes on other materials.
Duty Rate — Germany → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profiles (laser diced, straight, full arc) for semiconductor wafers
• Coolant temperature stability data critical for 8419 temperature process proof
• Standalone grinders without wafer handling may classify under 8460