8419.89.95.85/Double-Sided Wafer Lapper/Japan

Double-Sided Wafer Lapper from Japan

Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Thickness uniformity specs (±0.1μm) essential for semiconductor classification

• Demonstrate independent platen temperature controls

• Risk of 8428.19 classification as other continuous-action elevators if misdescribed