8419.89.95.85/Double-Sided Wafer Lapper/Germany

Double-Sided Wafer Lapper from Germany

Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.

Duty Rate — Germany → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Thickness uniformity specs (±0.1μm) essential for semiconductor classification

• Demonstrate independent platen temperature controls

• Risk of 8428.19 classification as other continuous-action elevators if misdescribed