Double-Sided Wafer Lapper from Germany
Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Thickness uniformity specs (±0.1μm) essential for semiconductor classification
• Demonstrate independent platen temperature controls
• Risk of 8428.19 classification as other continuous-action elevators if misdescribed