Double-Sided Wafer Lapper from China
Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Thickness uniformity specs (±0.1μm) essential for semiconductor classification
• Demonstrate independent platen temperature controls
• Risk of 8428.19 classification as other continuous-action elevators if misdescribed