Double-Sided Wafer Lapper from Canada
Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness uniformity specs (±0.1μm) essential for semiconductor classification
• Demonstrate independent platen temperature controls
• Risk of 8428.19 classification as other continuous-action elevators if misdescribed