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Double-Sided Wafer Lapper from Canada

Simultaneous double-sided lapping equipment for semiconductor wafers achieving sub-micron thickness uniformity through synchronized temperature-controlled platens. Classified under HTS 8419.89.95.85 for advanced wafer preparation on other materials.

Duty Rate — Canada → United States

14.2%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada

Import Tips

Thickness uniformity specs (±0.1μm) essential for semiconductor classification

Demonstrate independent platen temperature controls

Risk of 8428.19 classification as other continuous-action elevators if misdescribed

Double-Sided Wafer Lapper from Canada — Import Duty Rate | HTS 8419.89.95.85