8419.89.95.85/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. It uses controlled cooling/lubrication systems qualifying under HTS 8419.89.95.85 for wafer preparation equipment involving temperature management on other semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit boule diameter specs and flat grinding documentation to prove semiconductor wafer prep function

• Avoid generic 'grinding machine' descriptions; specify semiconductor material processing to stay in 8419