Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. It uses controlled cooling/lubrication systems qualifying under HTS 8419.89.95.85 for wafer preparation equipment involving temperature management on other semiconductor materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit boule diameter specs and flat grinding documentation to prove semiconductor wafer prep function
• Avoid generic 'grinding machine' descriptions; specify semiconductor material processing to stay in 8419