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8419.89.95.85/Compound Semiconductor Boule Saw/Mexico

Compound Semiconductor Boule Saw from Mexico

Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.

Duty Rate — Mexico → United States

14.2%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify wire diameter (50-200μm) and slurry temperatures for compound materials

• Prove boule-to-wafer yield improvements over standard saws

• Diamond wire saws without temp control risk 8461 classification

Compound Semiconductor Boule Saw from Mexico — Import Duty Rate | HTS 8419.89.95.85