8419.89.95.85/Compound Semiconductor Boule Saw/Japan

Compound Semiconductor Boule Saw from Japan

Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify wire diameter (50-200μm) and slurry temperatures for compound materials

• Prove boule-to-wafer yield improvements over standard saws

• Diamond wire saws without temp control risk 8461 classification