Compound Semiconductor Boule Saw from Germany
Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify wire diameter (50-200μm) and slurry temperatures for compound materials
• Prove boule-to-wafer yield improvements over standard saws
• Diamond wire saws without temp control risk 8461 classification