8419.89.95.85/Compound Semiconductor Boule Saw/Germany

Compound Semiconductor Boule Saw from Germany

Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.

Duty Rate — Germany → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify wire diameter (50-200μm) and slurry temperatures for compound materials

• Prove boule-to-wafer yield improvements over standard saws

• Diamond wire saws without temp control risk 8461 classification

Compound Semiconductor Boule Saw from Germany — Import Duty Rate | HTS 8419.89.95.85