Compound Semiconductor Boule Saw from Canada
Specialized wire saw for sectioning compound semiconductor boules (GaN, SiC) into wafers with diamond slurry and temperature-controlled wire tensioning. Under HTS 8419.89.95.85 for other materials wafer slicing equipment.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter (50-200μm) and slurry temperatures for compound materials
• Prove boule-to-wafer yield improvements over standard saws
• Diamond wire saws without temp control risk 8461 classification