8419.89.95.85/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP polisher for final surface preparation of semiconductor wafers using chemical slurries and mechanical pressure on temperature-regulated polishing pads. Under HTS 8419.89.95.85 as it involves temperature-controlled polishing in wafer preparation for other materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide slurry chemistry and pad temperature specs to validate temperature process involvement

• Certify for 200mm/300mm wafer sizes typical in semiconductor industry