Chemical Mechanical Wafer Polisher from Germany
CMP polisher for final surface preparation of semiconductor wafers using chemical slurries and mechanical pressure on temperature-regulated polishing pads. Under HTS 8419.89.95.85 as it involves temperature-controlled polishing in wafer preparation for other materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide slurry chemistry and pad temperature specs to validate temperature process involvement
• Certify for 200mm/300mm wafer sizes typical in semiconductor industry