Chemical Mechanical Wafer Polisher from Canada
CMP polisher for final surface preparation of semiconductor wafers using chemical slurries and mechanical pressure on temperature-regulated polishing pads. Under HTS 8419.89.95.85 as it involves temperature-controlled polishing in wafer preparation for other materials.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide slurry chemistry and pad temperature specs to validate temperature process involvement
• Certify for 200mm/300mm wafer sizes typical in semiconductor industry