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8419.89.95.85/Chemical Mechanical Wafer Polisher/Canada

Chemical Mechanical Wafer Polisher from Canada

CMP polisher for final surface preparation of semiconductor wafers using chemical slurries and mechanical pressure on temperature-regulated polishing pads. Under HTS 8419.89.95.85 as it involves temperature-controlled polishing in wafer preparation for other materials.

Duty Rate — Canada → United States

14.2%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Provide slurry chemistry and pad temperature specs to validate temperature process involvement

• Certify for 200mm/300mm wafer sizes typical in semiconductor industry

Chemical Mechanical Wafer Polisher from Canada — Import Duty Rate | HTS 8419.89.95.85