8419.89.95.40/Wafer Slicing Saw Coolant Chiller/Japan

Wafer Slicing Saw Coolant Chiller from Japan

Temperature-controlled coolant chiller for inner diameter wafer slicing saws per statistical note (a)(ii)(B), preventing thermal cracking of thin silicon wafers from boules. 8419.89.9540 for semiconductor wafer preparation cooling equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide wafer thickness specs (50-775μm) and kerf loss data

• Confirm integration with boule slicing saws vs general diamond saws