Wafer Slicing Saw Coolant Chiller from Japan
Temperature-controlled coolant chiller for inner diameter wafer slicing saws per statistical note (a)(ii)(B), preventing thermal cracking of thin silicon wafers from boules. 8419.89.9540 for semiconductor wafer preparation cooling equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wafer thickness specs (50-775μm) and kerf loss data
• Confirm integration with boule slicing saws vs general diamond saws