Wafer Slicing Saw Coolant Chiller from China
Temperature-controlled coolant chiller for inner diameter wafer slicing saws per statistical note (a)(ii)(B), preventing thermal cracking of thin silicon wafers from boules. 8419.89.9540 for semiconductor wafer preparation cooling equipment.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide wafer thickness specs (50-775μm) and kerf loss data
• Confirm integration with boule slicing saws vs general diamond saws