Wafer Slicing Saw Coolant Chiller from China
Temperature-controlled coolant chiller for inner diameter wafer slicing saws per statistical note (a)(ii)(B), preventing thermal cracking of thin silicon wafers from boules. 8419.89.9540 for semiconductor wafer preparation cooling equipment.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Provide wafer thickness specs (50-775μm) and kerf loss data
• Confirm integration with boule slicing saws vs general diamond saws