8419.89.95.40/Wafer Lapping Coolant Circulator/Japan

Wafer Lapping Coolant Circulator from Japan

Temperature-controlled coolant circulation system for wafer grinders and lappers, maintaining optimal slurry temperatures during semiconductor wafer preparation. HTS 8419.89.9540 covers this cooling machinery for material treatment in wafer fab processes. Ensures flatness tolerances per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include slurry temperature control specs and wafer grinder interface details in invoices

• Avoid general refrigeration classification by documenting semiconductor end-use