8419.89.95.40/Wafer Crystal Grinder Coolant System/Japan

Wafer Crystal Grinder Coolant System from Japan

Coolant delivery and temperature control system for crystal grinders preparing semiconductor boules to precise diameters per statistical note (a)(ii)(A). Maintains grinding wheel and boule temperatures for accuracy. HTS 8419.89.9540 cooling for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify boule diameter tolerances (150-450mm) and flat grinding specs

• Document integration with CZ/float zone boule grinders

• Avoid 8466 tool classification by emphasizing temperature treatment function