8419.89.95.40/Test Wafer Cooling Station/Japan

Test Wafer Cooling Station from Japan

Cooling station for monitor/test wafers used in semiconductor equipment qualification, rapidly bringing 300mm wafers from process temperatures to ambient. HTS 8419.89.9540 cooling for semiconductor testing preparation per statistical notes. Used before metrology.

Duty Rate — Japan → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document test/monitor wafer protocols and fab qualification procedures

• Distinguish from product wafer processing cooling