Semiconductor Wafer Chiller from China
A precision cooling unit designed for rapid temperature control of silicon wafers during semiconductor processing to prevent thermal damage. It falls under HTS 8419.89.9540 as machinery for cooling semiconductor materials by changing temperature in a controlled industrial process. Excludes domestic use and focuses on high-precision fab applications.
Duty Rate — China → United States
39.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Verify equipment is specifically for semiconductor wafer cooling with fab compatibility certifications to avoid reclassification
• Include detailed process descriptions in entry docs proving temperature change function per Chapter 84 notes