8419.89.95.40/Plasma Etch Chamber Cooling Loop/Japan

Plasma Etch Chamber Cooling Loop from Japan

Closed-loop cooling system for plasma etch reactor chambers, removing heat from RF electrodes and wafer chucks during dielectric etch processes. HTS 8419.89.9540 machinery for semiconductor temperature-controlled material treatment. Handles 500W+ power densities.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document etch rate dependency on chuck temperature uniformity

• Specify RF power handling and vacuum chamber integration