Plasma Etch Chamber Cooling Loop from Canada
Closed-loop cooling system for plasma etch reactor chambers, removing heat from RF electrodes and wafer chucks during dielectric etch processes. HTS 8419.89.9540 machinery for semiconductor temperature-controlled material treatment. Handles 500W+ power densities.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document etch rate dependency on chuck temperature uniformity
• Specify RF power handling and vacuum chamber integration