Laser Anneal Cooling Water System from Canada
High-flow deionized water cooling system for millisecond laser annealing equipment, rapidly cooling wafer backside post 1300°C melt for junction engineering. Classifies 8419.89.9540 as semiconductor processing cooling excluding domestic use.
Duty Rate — Canada → United States
14.2%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include laser power density and wafer bow control specifications
• Document DI water purity requirements for wafer protection
• Avoid 8419.20 medical cooling by proving semiconductor thermal processing