Ion Implanter Cooling Skid from Japan
Integrated cooling skid for high-power ion implanters, dissipating heat from beamline and target chamber during dopant implantation into semiconductor wafers. HTS 8419.89.9540 for production cooling machinery in device fabrication. Handles extreme thermal loads.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include beam current/thermal dissipation specs matching implanter models
• Classify as standalone cooling despite integration to avoid parts duty