8419.39.02/Wafer Lapping Dryer Module/Japan

Wafer Lapping Dryer Module from Japan

Modular drying unit attached to wafer lapping machines that evaporates lapping fluids using controlled hot air to achieve required flatness for device fabrication. Falls under 8419.39.02 as other industrial dryers for semiconductor material treatment.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Document flatness tolerance achieved (nanometers) for classification

• Classify as complete drying equipment even if modular

• Provide mounting interface specs for fab integration proof

Wafer Lapping Dryer Module from Japan — Import Duty Rate | HTS 8419.39.02