Wafer Lapping Dryer Module from Japan
Modular drying unit attached to wafer lapping machines that evaporates lapping fluids using controlled hot air to achieve required flatness for device fabrication. Falls under 8419.39.02 as other industrial dryers for semiconductor material treatment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flatness tolerance achieved (nanometers) for classification
• Classify as complete drying equipment even if modular
• Provide mounting interface specs for fab integration proof