Wafer Lapping Dryer Module from China
Modular drying unit attached to wafer lapping machines that evaporates lapping fluids using controlled hot air to achieve required flatness for device fabrication. Falls under 8419.39.02 as other industrial dryers for semiconductor material treatment.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document flatness tolerance achieved (nanometers) for classification
• Classify as complete drying equipment even if modular
• Provide mounting interface specs for fab integration proof