8419.39.02/Wafer Edge Grind Dryer Station/Japan

Wafer Edge Grind Dryer Station from Japan

Equipment for grinding wafer edges to specification followed by heated air drying to remove debris and liquids, critical for handling 300mm wafers without damage. Classified under 8419.39.02 for the temperature-controlled drying component in semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include throughput specs (wafers/hour) for valuation purposes

• Certify edge profiling accuracy to justify semiconductor classification

• Separate robotic handler components if imported individually