Semiconductor Wafer Drying Oven from Japan
Precision oven for drying semiconductor wafers after wet processing steps, maintaining controlled low humidity and temperature to prevent contamination. Falls under HTS 8419.39.02 as specialized industrial dryer for temperature-controlled material treatment in chip fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify cleanroom compatibility and humidity control features in documentation
• Include wafer size compatibility (200mm/300mm) for proper valuation
• Avoid retail dryer classification by emphasizing semiconductor fab use