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8419.39.02/Epitaxial Wafer Cool-Down Dryer/Japan

Epitaxial Wafer Cool-Down Dryer from Japan

Cooling/drying station following epitaxial reactor that controls wafer temperature while removing process gases and moisture using chilled nitrogen. Classified under 8419.39.02 for combined cooling/drying in semiconductor epi process.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify epitaxial material compatibility (Si, SiGe, GaN)

• Document gas flow rates and chill water requirements

• Include defect inspection integration specs