Epitaxial Wafer Cool-Down Dryer from Japan
Cooling/drying station following epitaxial reactor that controls wafer temperature while removing process gases and moisture using chilled nitrogen. Classified under 8419.39.02 for combined cooling/drying in semiconductor epi process.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify epitaxial material compatibility (Si, SiGe, GaN)
• Document gas flow rates and chill water requirements
• Include defect inspection integration specs