8419.39.02/Epitaxial Wafer Cool-Down Dryer/Japan

Epitaxial Wafer Cool-Down Dryer from Japan

Cooling/drying station following epitaxial reactor that controls wafer temperature while removing process gases and moisture using chilled nitrogen. Classified under 8419.39.02 for combined cooling/drying in semiconductor epi process.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify epitaxial material compatibility (Si, SiGe, GaN)

• Document gas flow rates and chill water requirements

• Include defect inspection integration specs

Epitaxial Wafer Cool-Down Dryer from Japan — Import Duty Rate | HTS 8419.39.02