Crystal Boule Grinder Dryer from Japan
Integrated system that grinds semiconductor crystal boules to precise diameter while simultaneously drying to remove grinding fluids and maintain surface quality. HTS 8419.39.02 covers this combined drying process essential for wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide engineering drawings showing integrated drying system
• Classify as complete machine, not parts, for correct duty rates
• Document flat grinding specifications per statistical note requirements