CMP Wafer Dryer from Japan
Chemical Mechanical Polishing post-process dryer using heated isopropyl alcohol vapor to dry wafers without leaving watermarks, critical for yield in advanced nodes. Classified in HTS Marplane39.02 for semiconductor-specific drying with temperature control.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify chemical compatibility (IPA, SC1, etc.) for proper documentation
• Include defectivity reduction data to justify specialized classification
• Check hazardous material handling certifications for solvents