CMP Wafer Dryer from Japan
Chemical Mechanical Polishing post-process dryer using heated isopropyl alcohol vapor to dry wafers without leaving watermarks, critical for yield in advanced nodes. Classified in HTS Marplane39.02 for semiconductor-specific drying with temperature control.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify chemical compatibility (IPA, SC1, etc.) for proper documentation
• Include defectivity reduction data to justify specialized classification
• Check hazardous material handling certifications for solvents