CMP Wafer Dryer from Japan
Chemical Mechanical Polishing post-process dryer using heated isopropyl alcohol vapor to dry wafers without leaving watermarks, critical for yield in advanced nodes. Classified in HTS Marplane39.02 for semiconductor-specific drying with temperature control.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify chemical compatibility (IPA, SC1, etc.) for proper documentation
• Include defectivity reduction data to justify specialized classification
• Check hazardous material handling certifications for solvents