Wafer Polishing Dryer from Japan
Integrated dryer following chemical mechanical polishing (CMP), employing heated air or vacuum to evaporate residuals while controlling temperature. HTS 8419.39.0280 for other dryers involving evaporation in semiconductor processing. Achieves mirror-finish wafer surfaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include CMP integration details in invoices to link to wafer processing
• Comply with ESD-safe packaging for electronic components